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Topic Review
Flux Classification
Flux is a granular material that primarily consists of oxides and CaF2. The manufacturing method plays an important role in shaping the flux features.
  • 1.2K
  • 09 Dec 2022
Topic Review
Preparation Methods for Large-Area Perovskite Solar Cells
Solar energy is one of the most encouraging, abundant, green, and renewable sources for decreasing or even replacing traditional energy in the future. The energy provided by the sun in one hour is sufficient to supply the Earth’s needs for an entire year. The recent rapid development in perovskite solar cells (PSCs) has led to significant research interest due to their notable photovoltaic performance, currently exceeding 25% power conversion efficiency for small-area PSCs. The materials used to fabricate PSCs dominate the current photovoltaic market, especially with the rapid increase in efficiency and performance.
  • 1.2K
  • 12 Apr 2022
Topic Review
Dodge Charger (L-body)
The Dodge Charger (L-body) was a subcompact 3-door hatchback/fastback built by Dodge from 1983 to 1987, and based on Chrysler's front-wheel drive L platform. A companion model, the Plymouth Turismo, was also marketed.
  • 1.2K
  • 19 Oct 2022
Topic Review
Fiat G.55
The Fiat G.55 Centauro (Italian: "Centaur") was a single-engine single-seat World War II fighter aircraft used by the Regia Aeronautica and the A.N.R. (Aeronautica Nazionale Repubblicana) in 1943–1945. It was designed and built in Turin by Fiat. The Fiat G.55 was arguably the best type produced in Italy during World War II, (a subjective claim also frequently made for the Macchi C.205 Veltro as well as for the Reggiane Re.2005 Sagittario) but it did not enter production until 1943, when, after comparative tests against the Messerschmitt Bf 109G and the Focke-Wulf 190, the Luftwaffe itself regarded the Fiat G.55 as "the best Axis fighter". During its short operational service, mostly under the Repubblica Sociale Italiana insignia, after the 8 September 1943 armistice, this powerful, robust and fast aircraft proved itself to be an excellent interceptor at high altitude. In 1944, over Northern Italy, the Centauro clashed with British Supermarine Spitfire, P-51 Mustang, P-47 Thunderbolt and P-38 Lightning, proving to be no easy adversary. Italian fighter pilots liked their Centauro but by the time the war ended, fewer than 300 had been built. By comparison, the Germans produced 35,000 Bf 109s.
  • 1.2K
  • 24 Oct 2022
Topic Review
GaN Electronic Devices
GaN has been widely used to develop devices for high-power and high-frequency applications owing to its higher breakdown voltage and high electron saturation velocity. The GaN HEMT radio frequency (RF) power amplifier is the first commercialized product that is fabricated using the conventional Au-based III–V device manufacturing process. In recent years, owing to the increased applications in power electronics, and expanded applications in RF and millimeter-wave (mmW) power amplifiers for 5G mobile communications, the development of high-volume production techniques derived from CMOS technology for GaN electronic devices has become highly demanded. 
  • 1.2K
  • 01 Jul 2021
Topic Review
Biowastes on Soil Remediation
Biowastes refer to the biodegradable food residues from private household and food industry, garden industry, municipal wastes, and sewage sludge.
  • 1.2K
  • 29 Jul 2021
Topic Review
Valorization of Bread Waste into Value-Added Products
Bread is a universal food that is sold and consumed across the entire social and geographical spectrum. Bread waste is currently of increasing interest, as it is considered a huge global issue with serious environmental impacts and significant economic losses that have become even greater in the post-pandemic years due to an increase in cereal prices, which has led to higher production costs and bread prices. Meanwhile, many efforts have been initiated in the past decades to investigate methods of repurposing bread residues into fuel and chemicals such as bioethanol, biohydrogen, succinic acid, and various added-value products that can be exploited in versatile industries.
  • 1.2K
  • 09 Dec 2022
Topic Review
Blockchain Technology in Logistics
The most successful applications of Blockchain Technology are still in the area of crypto-currencies, although both scientists and practitioners have discovered the potential of Blockchain Technology in Supply Chain Management. There is a significant theoretical literature on Blockchain Technology, but there exists a lack of published case studies and concrete examples.
  • 1.2K
  • 14 Jul 2021
Topic Review
Goal (Sport)
In sports, a goal is a physical structure or area where an attacking team must send the ball or puck in order to score points. In several sports, a goal is the sole method of scoring, and thus the final score is expressed in the total number of goals scored by each team. In other sports, a goal may be one of several scoring methods, and thus may be worth a different set number of points than the others. The structure of a goal varies from sport to sport. Most often, it is a rectangular structure that is placed at each end of the playing field. Each structure usually consists of two vertical posts, called goal posts, supporting a horizontal crossbar. A goal line marked on the playing surface between the goal posts demarcates the goal area. Thus, the objective is to send the ball or puck between the goal posts, under or over the crossbar (depending on the sport), and across the goal line. Less commonly, as in basketball or netball, goals are ring-shaped. The structure is often accompanied with an auxiliary net, which stops or slows down the ball when a goal is scored.
  • 1.2K
  • 11 Nov 2022
Topic Review
TCV and TGV Technology
Through ceramic via (TCV) technology expands the volume of high-precision and high-power thin-film circuits with 3D planar distribution, significantly improves the structural density and reduces the device size through via interconnection and circuit redistribution. Through glass via (TGV) technology has the advantages of high-density interconnection and low-loss transmission, which forms a highly reliable interconnection between the chip and the substrate, has higher I/O density and smaller spacing, and realizes passive on-chip devices, high-density copper interconnection and the heterogeneous integration of chips. Therefore, 3D integration and system-level packaging technology have developed rapidly.
  • 1.2K
  • 26 Jul 2023
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