The application of epoxy adhesive is widespread in electronic packaging. Epoxy adhesives can be integrated with various types of nanoparticles for enhancing thermal conductivity. The joints with thermally conductive adhesive (TCA) are preferred for research and advances in thermal management. The rapid advancement of microelectronic technology has resulted in the progressive transformation of electronic components from isolated to highly integrated. It produces a lot of heat while they are functioning. The materials and structures used to attach the semiconductor chip to other electronic components involve the sector of electronic packaging. Conductive adhesives represent a significant advancement in electronic packaging for advanced devices, where effective heat dissipation and enough electrical conductivity are critical. The TCA joint is a crucial choice for the thermal management of the device. The advances in TCA are essential because of future demands for inexpensive and handy electronic devices. The adhesive applications have become more important due to their remarkable versatility and unparalleled compatibility. The electronic industry has indeed developed, especially in consumer electronics, which depends on conductive adhesives. It would not be possible to identify the most modern electronic devices without conductive adhesives.
Material | TC (Wm−1 K−1) | Material | TC (Wm−1 K−1) |
---|---|---|---|
Aluminum oxide | 20–30 | Graphite | 100–400 (on plane) |
Molybdenum | 142 | Silver | 450 |
Tungsten | 155 | Copper | 401 |
Nickel | 158 | Silicon carbide (SiC) | 490 |
Aluminum | 204 | Diamond | 2000 |
Beryllium oxide | 260 | Boron nitride | ~2000 (in-plane); ~380 (out-of-plane) |
Carbon fiber | 260 | Multiwalled carbon nanotube (MWCNT) | ~3000 |
Aluminum nitride (AlN) | 200–320 | Graphene | ~5300 |
Gold | 345 | Single-walled carbon nanotube (SWCNT) | ~6000 |
Filler | Conditions/Process | TC (Wm−1 K−1) | References |
---|---|---|---|
BN | Platelet-shaped Boron Nitride(BN) particles | 3.5 | [73] |
BN | At 70 wt% functionalized and mix with epoxy resin | 2.8 | [50] |
BN | Admicellar-treated BN particles. | 2.7 | [74] |
BN | 30 wt% of BN particles modified by 3-aminopropyl triethoxysilane | 1.178 | [75] |
BN | Hexagonal BN/epoxy composites at 44 vol% (densely packed and vertically aligned). | 9 | [76] |
BN | Hexagonal, cubic, and conglomerated -BN. | 2.91, 3.95, and 10.1 | [77] |
BN | Hexagonal boron nitride laminates | 20 | [78] |
BN | Untreated and OTAB-treated BN/epoxy composites. | 1.9 and 3.4 | [79] |
BN | 88 wt% of BN loading. | 32.5 | [80] |
AlN | 58.4 vol% of large-sized Aluminum nitride (AlN) with small-sized Al2O3 | 2.842 and 3.4 | [81] |
AlN | 29 wt% of MWCNTs/AlN | 1.04 | [82] |
AlN | 20 vol% AlN particles (magnetically aligned) | 1.8 | [83] |
AlN | 50 wt% of 5 μm-AlN particles and 6 wt% of GO | 2.77 | [65] |
AlN | 67 vol% of AlN particles (large-sized silane-coated). | 14 | [84] |
AlN | Cycloaliphatic epoxy/trimethacrylate system | 0.47 | [85] |
AlN | At 47 vol% nano-whiskers AlN | 4.2 | [86] |
Al2O3 | At 80 wt% of Alumina (Al2O3)/epoxy, filled with 5 wt% of graphene oxide (GO) and 5 wt% of Al(OH)3-coated GO | 3.5 and 3.1 | [87] |
Al2O3 | Al2O3/GFRP (amino group grafted) | 1.07 | [17] |
Al2O3 | At 60 vol% of micron-sized alumina | 4.3 | [88] |
SiC | Magnetically aligned BN and Silicon Carbide (SiC) filler system | 5.77 | [70] |
SiC | Nano-sized SiC particles with triethylenetetramine (TETA) functionalized MWCNTs, (at 30% vol%) | 2.00 | [89] |
SiC | At 20 vol% of SiC particles (magnetically aligned Fe3O4 coated) | 1.681 | [90] |
This entry is adapted from the peer-reviewed paper 10.3390/polym13193337