In modern power systems, Power Electronic Converters (PECs) play a crucial role. Extensive research indicates that PECs are primary contributors to failures in specific applications, such as renewable energy systems, with power semiconductors accounting for 31% of device failures. Among the failure mechanisms in Wide Bandgap (WBG)-based power modules, the junction temperature (Tj) and junction temperature swing (ΔTj) emerge as critical factors contributing to solder and wire bond degradation. Consequently, effective control of junction temperature swings holds significant potential for extending the lifetime of PECs. It should be noted that the primary cause of temperature swings lies in power dissipation fluctuations resulting from conduction and switching losses. These fluctuations induce thermo-mechanical fatigue between layers with varying coefficients of thermal expansion (CTE).