2. Dynamic Covalent Bonds in Self-Healing ECMs
Covalent bonds possess higher fracture tolerance than non-covalent bonds, which can endow the polymer matrix with stronger mechanical properties. Self-healing polymers based on dynamic covalent bonds can undergo dynamic bond dissociation and rearrangement under external stimuli. Due to the stability of bonds and the high efficiency of the reversible reaction, self-healing polymers can heal the damaged parts independently.
2.1. Diels–Alder Reaction
The Diels–Alder reaction is a cycloaddition reaction, that is, the reaction of conjugated dienes with substituted olefins (dienophiles) to form cyclohexene adducts
[53]. Common conjugated dienes include furan, furan amine, furan alcohol, furan mercaptan and tetrahydrofuran methacrylate, and frequent dienophiles include maleic anhydride, maleimide and bismaleimide
[54][55][56]. The Diels–Alder reaction is thermoreversible, for which the degree of the reaction can be controlled using temperature. Therefore, this mechanism is suitable for self-healing polymers.
Liang et al.
[57] designed a TFP (trifuryl propane)-FTPB (furyl terminated polybutadiene)-PDMI (N, N′-1,3-Phthalic maleimide) self-healing binder based on the Diels–Alder reaction. The synthesis methods of TFP and FTPB are shown in
Figure 2a. The addition of TFP improved the perfection of the polymer cross-linking network, which is conducive to tensile strength. The existence of Diels–Alder bonds ensured the healing of cracks (
Figure 2b). At 120 °C, the occurrence of the Retro-Diels–Alder reaction caused the separation of diene and dienophile, and the molecular mobility increased as the molecular chain became shorter. Active molecular diffusion is beneficial to the rearrangement of molecular chains. At 60 °C, the reassociation of Diels–Alder bonds further repaired the mechanical damages of materials. The self-healing process could be observed directly using the hot-stage optical microscope. As shown in
Figure 2c, the crack width was significantly reduced compared with that before healing, which is mainly related to the thermal reversibility of Diels–Alder bonds.
Figure 2. (
a) Synthetic route of FTPB and TFP, (
b) the self-healing process of TFP-FTPB-PDMI film and (
c) the corresponding optical microscope images (reproduced from Ref.
[57] with permission; Copyright MDPI, 2017).
Subsequently, Xia et al.
[58], based on Liang’s work, synthesized a novel FTPB using the reaction of isocyanate terminated polybutadiene with fury amine, and then prepared self-healing binder films (FTPB-DAs) based on the Diels–Alder reaction system using the reaction of furan with bismaleimide. The FTPB-DA could be converted to FTPB and bismaleimide at 120 °C. When the temperature dropped to 60 °C, it would be re-crosslinked to form FTPB-DA, thus showing that it has a self-healing property (
Figure 3a). In Xia’s strategy, the content of furan groups on the FTPB skeleton could be adjusted by changing the ratio of -NCO and -OH, so as to regulate the chemical crosslinking density of the binders, which is convenient for further balancing the mechanical properties and self-healing properties. Binders with thermal reversibility were further utilized with HMX to prepare PBX (DAPU-HMX)
[59]. A CT test showed that, after impact, three cracks formed in the damaged sample, which gradually reduced or even disappeared after healing (
Figure 3b). The Brazilian test results indicated that the mechanical properties of the damaged DAPU-HMX samples were seriously reduced, and the healed mechanical strength could recover to 85% of the initial (
Figure 3c,d). Thermally reversible Diels–Alder bonds have been shown to be effective for the self-healing of ECMs. The rearrangement of molecular chains and the reassociation of Diels–Alder bonds at the crack repair the damaged network and form new “topological entanglements”. The “topological entanglements” further restore the mechanical properties of the materials. However, for the self-healing binders based on the Diels–Alder reaction, the activation temperature of the Retro-Diels–Alder reaction that is responsible for the repair process is as high as 100~130 °C. For sensitive energetic materials, safety needs further evaluation. Therefore, researchers tend to apply mild dynamic chemistries to ECMs.
Figure 3. (
a) Thermoreversible process of FTPB-DA for self-healing (reproduced from Ref.
[58] with permission; Copyright Royal Society of Chemistry, 2021), (
b) CT images, (
c) Brazilian test method and (
d) mechanical strength of DAPU-HMX (reproduced from Ref.
[59] with permission; Copyright Elsevier, 2019).
2.2. Disulfide Exchange Reaction
Disulfide bonds are ubiquitous in organisms and are mainly used to maintain the tertiary structure of proteins, which can be dissociated under the action of light, heat or mechanical force
[60][61], or be reformed and exchanged in the appropriate temperature and pH environment (
Figure 4a)
[62][63]. In addition, disulfide exchange provides significant advantages in self-healing, because S–S bonds can be combined into networks with low glass transition temperature, promoting low-temperature reversibility
[64].
CSPs are mainly composed of polymer binders, oxidizers, combustion promoters, aluminum powder and other components
[65][66]. In order to ensure high energy, the highly energetic crystals in CSPs usually exceed 80 wt%, while polymer binders are mostly less than 20 wt%
[67]. In other words, CSPs belong to a kind of high-filling polymer composite. Such compositional characteristics usually result in low strength and high brittleness. In practical application, the crystal layer is easy to peel off from the coating due to the influence of a complex environment such as external temperature and stress, which leads to the generation of cracks/voids
[68][69]. The rearrangement and exchange of disulfide bonds could promote the reattachment of coatings and grain layers, thus healing the debonding interface (
Figure 4b)
[70]. Furthermore, dynamic disulfide bonds can exhibit high dynamics at lower temperatures, so they are also suitable for repairing cracks/defects inside ECMs. Li et al.
[71] prepared a new polyurethane binder (DSPU) with polycaprolactone glycol as the molecular skeleton and bis (4-aminophenyl) disulfide as the chain extender to solve the micro damage problem in PBXs (
Figure 4c). Due to the covalent dynamic disulfide bonds in the binders, heat drives in situ healing at the crack/defect. The damaged CL-20-based PBXs just require being heated to 60 °C for several hours to repair, which is obviously related to the dynamic chemical properties of disulfide bonds under heating conditions.
Figure 4. (
a) Disulfide chain exchange (reproduced from Ref.
[63] with permission; Copyright Copyright Springer Nature, 2020), (
b) the self-healing of the debonding interface between the grain and coating layer(reproduced from Ref.
[70] with permission; Copyright Royal Society of Chemistry, 2020), (
c) the preparation and the damage self-healing of CL-20-based PBX using DSPU as binder(reproduced from Ref.
[71] with permission; Copyright Elsevier, 2019).
An energetic binder is a kind of polymer with a large number of energetic groups on molecular chains
[72][73][74]. Compared to traditional inert binders, energetic binders possess not only the basic performance of binders, but also the energy properties
[75][76]. Among the most energetic groups, -N
3 has a high positive formation enthalpy (+355.6 kJ mol
−1). The introduction of -N
3 into the polymer will not affect the original hydrocarbon ratio. Moreover, -N
3 could perform thermal decomposition independently before the main chain, which not only increases the energy density of the binder, but also facilitates the decomposition of ECMs to some extent
[77]. Glycidyl azide polymer (GAP) is a hydroxy terminated polymer with a large amount of -N
3, which is usually obtained using modification and azidation of poly(epichlorohydrin)
[78][79][80]. In order to further improve the energy level of ECMs, GAP, as an energetic polyether, has gradually attracted attention. Compared with the inert binders, the ECMs with GAP-based binders showed excellent combustion performance (
Figure 5a)
[81].
Figure 5. (
a) Sequential open-combustion images of ECMs with GAP-based binders and ECMs with inert binders (reproduced from Ref.
[81] with permission; Copyright Royal Society of Chemistry, 2021), (
b) the self-healing process of GAPUV (reproduced from Ref.
[82] with permission; Copyright Royal Society of Chemistry, 2021), (
c) the synthesis process and microstructure of EPU-SS(reproduced from Ref.
[83] with permission; Copyright American Chemical Society, 2021), (
d) preparation and healing process of ECMs with EPU-SS as binders (reproduced from Ref.
[84] with permission; Copyright Elsevier, 2022).
Hu et al.
[82] utilized GAP, 2-hydroxyethyl disulfide (HEDS) and trimethylolpropane (TMP) as a soft segment, chain extender and cross-linking agent, respectively, to prepare a series of polyurethane vitrimers (GAPUVs). Using an optimization of the crosslinking density and composition of thermosetting GAPUVs, the mechanical properties were significantly improved. With the addition of dynamic disulfide bonds, GAPUVs showed obvious healing ability (
Figure 5b) and reprocessing ability after mild heating. Furthermore, the scratch-healing efficiency of the ECMs with GAPUVs (binders) and aluminum powder could exceed 95%. Subsequently, Ding et al.
[83] synthesized a self-healing energetic linear polyurethane elastomer (EPU-SS) based on disulfide bonds (
Figure 5c). The elastomer was prepared using a two-step method and possessed high self-healing efficiency and mechanical properties, which were attributed to the carefully designed surface energy driving and dynamic hard domains. Then, based on the physical model of interface healing, the variation trend in surface tension, crack bottom radius and depth during the healing process was calculated, and the mechanism of interface healing was obtained. The polyurethane elastomer with low crosslink density could generate excess surface energy at the damage sites to drive the self-healing process, and the addition of a small number of disulfide bonds could further reduce the healing energy barrier. Overall, high filler loading will improve the hardness of polymer composites but will also hinder the process of interface healing. Therefore, the healing ability and mechanical strength of ultra-high-filling polymer composites are contradictory and difficult to optimize at the same time. Ding et al.
[84] used EPU-SS as a binder to prepare ECMs with RDX and aluminum powder, which developed a crack-healing method (
Figure 5d). The compressive stress at room temperature significantly increased the interface contact effect. Then, the adhesion effectively closed the crack, the surface energy driving promoted the movement of the polymer chains and the reversibility of disulfide bonds helped to rebuild a new polymer network at the interface, thus showing that the cracks could be repaired. In the future, it will be more practical if the reasonable configuration of mechanical properties and efficient self-healing ability can be realized to simplify the crack-healing process.
2.3. Dynamic Chemical Reactions of Other Covalent Bonds
Acyl semicarbazide (ASCZ) is a combination of urea and amide linked by an N–N bond, which can be easily formed using the addition reaction of isocyanate and hydrazide
[24]. The ASCZ motif is dynamic, which can form an activated n-center transition state, promote proton transfer and, thus, reduce the dissociation energy barrier in ASCZ motifs
[85]. Under high temperature, the ASCZ group can reversibly generate isocyanate and hydrazide (
Figure 6a)
[24], which shows thermal reversibility, providing a new direction for the molecular engineering design of high-performance dynamic polymers. However, similar to Diels–Alder bonds, the rapid dissociation of ASCZ groups needs to be carried out at ~120 °C.
As a major group element, selenium has similar chemical properties to sulfur. It is worth noting that the bond energy of the Se–Se bond (172 kJ mol
−1) is lower than that of the S–S bond (240 kJ mol
−1), which means that the selenium bond, as a dynamic covalent bond, can respond to more mild stimuli, thus stimulating new molecular engineering
[86][87]. It has been proven that the dynamic exchange reaction of the selenide bond can take place under heating or visible light irradiation (
Figure 6b)
[88]. It is reported that the dynamic recombination of the selenide bonds could be effectively used to restore the integrity of the asphalt network at fracture (
Figure 6c)
[34], providing a new design strategy for ECMs with ultra-high filling. Compared to disulfide bonds, lower bond energy reduces the energy barrier of self-healing. It can be predicted that the dynamic exchange of selenium bonds at the crack/defect can realize the autonomous repair of composite materials. However, low bond energy is not conducive to mechanical properties. Great efforts are still needed to balance network dynamics and robustness.
Figure 6. (
a) Dynamic chemistry of ASCZ groups (reproduced from Ref.
[24] with permission; Copyright American Chemical Society, 2020), (
b) visible-light-induced self-healing process of diselenide-containing polymer (reproduced from Ref.
[88] with permission; Copyright Wiley, 2015), (
c) crack healing of composites using diselenide-containing polymers as binders (reproduced from Ref.
[34] with permission; Copyright Elsevier, 2021).