AlCr-based hard nitride coatings with different chemical compositions and architectures have been successfully developed and applied over the last few decades. Coating properties are mainly influenced by deposition conditions and the Al/Cr content. The fcc structure is dominant for an Al-content up to Al0.7Cr0.3N and is preferred for most cutting applications. Different (AlCrX)N alloying concepts, including X = Si, W, B, V, have been investigated in order to enhance oxidation resistance and wear behaviour and to provide tribological properties. AlCr-based oxynitrides and even pure oxides (Al1−xCrx)2O3 with different crystalline structures have been explored. Multi- and nanolayered coatings within the AlCr materials system, as well as in combination with (TiSi)N, for example, have also been implemented industrially. The dominant deposition technology is the vacuum arc process. Recently, advanced high-power impulse magnetron sputtering (HiPIMS) processes have also been successfully applied on an industrial scale.
Surface solutions using PVD (Physical Vapor Deposition) coatings for the improvement of the wear resistance and tribological properties of tools and components started on an industrial scale around the middle of the 1970s in the Soviet Union. The first component coating was MoN [1]. The first successful industrial coating for tooling applications in Western Europe was the “golden” TiN coating applied by low-voltage arc evaporation developed at Oerlikon Balzers [2]. A modification of this coating with carbon followed, and the TiNC coating types were implemented in mass production at the end of the 1980s. In parallel, Cr-based coatings were also introduced, including modifications using oxygen and carbon [3]. Besides nitride, carbonitride and oxynitride coatings, hard amorphous carbon coatings, the DLC (Diamond Like Carbon) coatings, were developed and applied as well [4][5]. These coatings were deposited using several coating architectures [6]. Many coating developments focused on alloying TiN using different additional elements [5].
The most important industrial development after TiN, CrN and DLC was achieved in the Ti-Al-N system [7]. Around the year 2000, this coating family was the dominant coating, especially for cutting tools [8][9]. However, in the Ti-Al-N system, only minor improvements of coating properties and the performance of cutting tool applications were possible, e.g., by alloying with Si, Y, Cr, C, O [10][11][12][13]. A big step forward was achieved through the investigation of totally new coating compositions. This led to the development of a new coating generation based on Al-Cr-N. Coatings in the AlCrN system span the compositional range from Al-rich to Cr-rich. In this paper, the terminology CrAl-based is used for coatings with a Cr content that is higher than that of Al (Cr/Al > 1 in at.%), and conversely, AlCr-based is used for coatings in which Al/Cr > 1.
Results dealing with coatings with a low Al content (Al/(Al + Cr) ratio < 0.5) and (CrAl)N coatings, deposited by sputtering, were published for the first time in 1990 [14][15]. In the same year, coatings with an Al/(Al + Cr) composition of about 0.5 deposited using a modified hollow cathode discharge process were also presented [16]. Arc evaporation was used to deposit (AlCr)N coatings with a high Al content with an (Al/(Al + Cr) ratio of >0.5 [17][18]. The first multilayer coating with an Al content greater than the Cr content was a multilayer architecture with CrN [19]. Another big step was the development of (TiSi)N coatings [20]. Coating solutions were also developed which combined the two coating types in multilayer structures [21].
A challenge for turning tools was, and still is in part, the development of alpha-alumina using PVD. A PVD solution to add metallic doping elements to aluminium was patented in 1992 [22]. Processes to deposit oxides based on arc evaporation were successfully developed on the basis of Al-Cr cathodes [23].
Various deposition technologies have been used to synthesise (CrAl)N and (AlCr)N coatings over a period of about 30 years. Basic information about the deposition technologies is beyond the scope of this review. The interested reader is invited to look at available publications [24][25][26][27][28][29][30][31]. Some more exotic evaporation methods are hollow cathode arc evaporation [16] and activated reactive evaporation [32]. The first application of AlCr-based coatings for cutting tools deposited by hollow cathode arc was mentioned very early [16][33]. However, primarily sputtering processes and arc processes were used both for basic investigations as well as for applications.
The first reported (CrAl)N coatings were DC (Direct Current) magnetron sputtered [14][15]. The first arc coatings were deposited using elemental cathodes of pure Al and pure Cr [17]. The first multilayer coating (AlCr)N was (AlCr)N/CrN deposited by arc [19]. Sometimes even hybrid methods, such as arc plus hollow cathode discharge [34] or, more commonly, arc plus sputtering [35], have been used. Alloyed CrAl-based and AlCr-based coatings are most commonly deposited either by magnetron sputtering or by arc evaporation. For sputtered coatings, the preferred methods are various HiPIMS processes in industrial applications, e.g., the S3p process [30]. The deposition of alpha alumina coating is based on a dedicated pulsed arc process, the P3e process [23].
It should be mentioned that the main differences between arc deposition processes and sputtering are:
Arc-deposited coatings have more growth defects in the coating than sputtered coatings due to macroparticle generation in the arc evaporation process. Sputtered coatings are thus preferred in applications requiring particularly low surface roughness.
The arc process allows a higher growth rate to be achieved than sputtering, depending on the PVD system set-up.
Arc evaporation is known to produce plasmas with a high degree of ionisation. Multiple charge states are formed as well in arc evaporation [36]. Sputtering processes are characterised by lower degrees of ionisation [26].
The specific energy consumption of the arc process is lower than that of sputtered coatings for the same coating thickness [37].
Arc processes tend to exhibit higher process stability than sputtering processes.
: Arc processes can be more easily upscaled for coating long parts (several metres).
The different basic methods used for CrAl-based and AlCr-based coatings are listed here briefly.
CrAl-based and AlCr-based coatings are deposited by reactive direct vacuum arc using either elemental cathodes or composite cathodes. The first (CrAl)N and (AlCr)N coatings were deposited by the reactive co-evaporation of elemental chromium and aluminium cathodes available at that time [17][18][19].
The first composite cathodes suitable for arc evaporation manufactured by a powder metallurgical process were produced by Plansee AG, Austria, and were used successfully for tool coatings in 1995 [38]. Later, composite cathodes became the standard, especially in industrial applications [39][40]. A special pulsed process was developed for alpha (Al
Cr
)
O
coatings, the P3e process [23]. The main goal of the pulsing is to overcome process difficulties generated by the oxide process (cathode, anode reactions).
Several sputtering methods as well as combinations of different sputtering methods have been used to deposit both CrAl-based and AlCr-based coatings from elemental or composite cathodes. Even special processes based on the combination of composite targets combined with elemental targets have been realised [41]. The first CrAl-based coatings were deposited by reactive DC magnetron sputtering of a composite target (Cr
Al
) [14][15]. Additionally, newer research on a laboratory scale as well as industrial-scale PVD systems are using DC magnetron sputtering [41][42][43][44][45][46]. It should be noted that special magnetic field configurations can be achieved within the PVD systems by means of the magnetron set-ups, e.g., the CFUBM (Closed Field Unbalanced Magnetron Sputtering) [47][48]. RF (Radio Frequency) sputtering has been used for basic investigation [49][50]. Even the combination of RF sputtering plus DC sputtering has been applied [51][52], though RF sputtering is typically not used for industrial applications.
Besides standard pulsed magnetron sputtering [41], the mode of dual pulsed magnetrons has also been used [48]. The most advanced pulsed sputtering method is high-power impulse magnetron sputtering. Pulses with peak power densities in the range of several hundred W/cm
up to several thousand W/cm
are achieved in classic high-power impulse magnetron sputtering (HiPIMS), also referred to as HPPMS, MPP or HIPAC. The pulse duration is usually in the range of 25 to 250 μs [41][53][54][55][56]. The longest pulse lengths of around 1000 μs are used in the case of MPP [57].
A dedicated HiPIMS process, known as the S3p process, is a process that runs with a constant pulse current and can operate using longer pulses than the classic HiPIMS process. The pulse duration often lies in the range of several milliseconds [30].
A brief description of selected aspects of industrial systems will be provided here. In-depth descriptions of deposition systems are available elsewhere [27][30]. Both system configurations, set-ups with magnetrons and set-ups with arc evaporators, use particle sources with either a circular, rectangular or tubular geometry for the active evaporation surfaces, as shown in
. The circular form dominates for arc evaporation, whereas the rectangular and the cylindrical forms are used most commonly for sputtering. In addition to arc and sputtering systems, hybrid systems, e.g., arc plus HiPIMS, are also in use [29].

Schematic drawing of the circular, rectangular or tubular active evaporation surfaces, redrawn after [27], original © Vulkan-Verlag, Germany.
For the deposition of AlCr-based coatings, powder metallurgically manufactured composite targets are used most commonly. Sputtering has the advantage that composite targets in the form of segmented targets or targets with plugs of a second type of material (e.g., Cr plugs in Al target plates) can also be used [48].
Modern coating systems run in fully automatic operation. They must fulfil the following criteria with respect to high productivity and quality: high production reliability, short cycle times, high flexibility in coating types and substrate holders, easy maintenance. Additional aspects are CE (Conformité Européenne), conformity and high occupational safety standards. Environmental sustainability is also gaining importance, including the influence of factors such as energy consumption.
Of course, the basic components of the coating systems must also be optimised, e.g., vacuum pumps, power supplies, particle sources, heaters, substrate holders. In addition, all process steps including loading, pumping, heating, ion cleaning, coating, cooling, unloading and maintenance must be optimised for short cycle times and efficient operation. The choice between batch systems or inline systems depends on the use and the required flexibility. Batch systems are predominant for industrial coating applications. The system size is selected based on the expected batch size as determined by the dimensions and number of parts to be coated, but also by operating economy.
The usable volume of a batch system is defined by the interior size of the deposition chamber. Usually, coating systems are designed with a circular geometry along a central axis, allowing the rotation of substrates. The maximum useful volume therefore constitutes a cylindrical body. Small coating systems typically have a diameter of <0.5 m and a height of <0.5 m, which is adequate for small-scale series or research facilities. Medium size systems, with roughly a diameter of 1 m and a height of 1 m, are predominant in industrial production.
shows an arc system equipped with circular arc evaporators, and a coatable diameter of 0.7 m and a height of 0.9 m. Special-purpose systems are available for large-scale manufacturing, with roughly a diameter of 1.5 m and a height of 1.5 m. Systems for oversized parts, such as broaches or plastic extrusion screws, have a coating height of up to 4.5 m.

Medium-sized arc system equipped with circular arc evaporators, diameter 0.7 m, height 0.9 m, courtesy of Oerlikon Balzers.
CrAl-based and AlCr-based coatings deposited by arc evaporation processes or by magnetron sputtering are widely used for cutting tools, moulds, dies and for various components. The success of these coatings with their predominantly fcc structure is due to their outstanding mechanical and tribological properties (such as high hot hardness, good abrasive and sliding wear resistance) combined with high oxidation and corrosion resistance. The present chapter highlights selected basic coating properties.
To begin with, an important remark must be made on the way the coating composition is reported in papers. A full compositional characterisation, including metallic and non-metallic elements as well as impurities such as oxygen, is the most complete, but is not always reported. Several publications neglect the stoichiometric aspects, the deviation of coating composition from the cathode/target composition, and the incorporation of residual gas components. Sometimes, only the cathode/target composition or only one of the values Al/Cr or Al/(Al + Cr) are given, presumably because methods such as EDS are most suited for the characterisation of metallic and heavy elements. Many papers state that the coatings consist stoichiometrically of 50 at.% metallic and 50 at.% non-metallic elements, and they are simply described as (Al
Cr
)N.
One positive example is described for arc-deposited coatings using cathodes of Al
Cr
. The coating was characterised by XPS as having Al 33.1 at.%, Cr 15.8 at.%, N 48.1 at.%, and O 3.0 at.%. The metallic content is thus 48.9 at.% and the non-metallic content is 51.1 at.%. The ratio Al/(Al + Cr) is 0.68, meaning 68 at.% of the metallic content is Al. This corresponds to a deviation of 2 at.% from the cathode material. The Al/Cr ratio in the coating is 2.09. The coating contains oxygen from the residual gas. The coating is slightly over-stoichiometric [58]. The total formula has to be (Al
Cr
)(N
O
) plus the stochiometric ratio (Al
Cr
)/(N
O
). Unfortunately, however, detailed compositional data are not reported in many publications.
As a guide for the reading of coating compositions, the following terminology is used throughout this paper.
If only the cathode composition is given and the stoichiometry in the coating is assumed to be equivalent to the cathode composition, the coating is described as (Al
Cr
)N with 100 in at.%, e.g., (Al70Cr30)N.
If the metallic elements (and metalloids) were measured, but only a general statement about the stoichiometry is made, the coatings are described as (Al
C
)N with 100 in at.%, e.g., (Al
Cr
)N.
If both metallic elements (and metalloids) and the N, O (and C) content were measured, all values are given as Al
Cr
N
O
where
+
+
+
= 100 at.%, e.g., Al
Cr
N
O
.
A schematic diagram of different basic crystal structures as a function of the Al portion of the coating’s metallic content in at.% is shown in
. It should be mentioned that in publications, the formula Cr
Al
N or Al
Cr
N is sometimes used for the same coating in dependence on the Al content. Nowadays, the most commonly used terminology in industrial applications is the short name (AlCr)N for Al-rich coatings. The authors suggest that coatings with a chemical composition in at.% of Cr > Al should be named (CrAl)N. If Al > Cr, then the coating should be named (AlCr)N. (CrAl)N coatings always have an fcc crystal structure. This structure type is also referred to as B1, a NaCl structure or c in certain publications, depending on the convention. With increasing Al content, a phase evolution to an hcp crystal structure takes place, which is also referred to as B4, a ZnS-type structure, wurtzite, w, h or hcp in publications. In the following, fcc and hcp will be used.

Schematic diagram showing the basic crystal structure of (CrAl)N and (AlCr)N coatings as a function of the Al content.
XRD investigations of rf-sputtered coatings have shown that at 57 at.% Al, a pure fcc structure was obtained, while at 75 at.% Al, the hcp structure was observed. The transition range between fcc and fcc + hcp was in the range of 57 at.% < Al
< 67 at.% [49]. With pulsed closed-field magnetron sputtering, the formation of hcp phases was observed at an Al content of 64 at.%, whereas fcc phases were detected at up to 60.9 at.%, giving a transition range of 60.9 at.% < Al
< 64 at.% [59]. A systematic experimental investigation of (CrAl)N and (AlCr)N coatings synthesised using the cathodic arc method showed that the crystal structure changed from a pure fcc structure to a mixed-phase structure of fcc and hcp at an Al content of about 60–70 at.% of the metal content in the cathodes [60], whereas an fcc structure was observed at up to 71 at.% in the coating by the authors of [61].
The reported different maximum Al contents for the X-ray-diffraction-measured pure fcc phase differ over a range of about 60–70 at.%, as shown in
.
Maximum Al content for pure fcc phase generation measured by X-ray diffraction for arc-deposited and sputtered coatings.
| Deposition Method | Source Composition (Targets/Cathodes) |
Pure fcc Phases by X-Ray at Al [at.%] Coating or Source | Fcc + hcp Phases by X-Ray at Al [at.%] Coating or Source | Range of Transition Al | max | [at.%] | Reference | |
|---|---|---|---|---|---|---|---|---|
| RF sputtering | Al and Cr targets | Coating 57 at RT 56 at 300 °C |
Coating 75 at RT 67 at 300 °C |
Coating 57 < Al | max | < 67 | [49] | |
| RF/DC sputtering | Al and Cr targets | Coating 63 at 300 °C |
- | 63 < Al | max | [51] | ||
| Pulsed CFUBM sputtering |
Al and Cr targets |
Coating 60.9 at 175 °C |
Coating 64 at 175 °C |
Coating 60.9 < Al | max | < 64 | [59] | |
| Arc | Alloyed cathodes | Cathodes 60 at 600 °C |
Cathodes 70 at 600 °C |
Cathodes 60 < Al | max | < 70 | [60] | |
| Arc | Alloyed cathodes | Coating 70 at 500 °C TEM traces hcp |
- | Coating 70 < Al | max | [62] | ||
| Arc | Alloyed cathodes | Coating 71 at 450 °C |
Coating 75 at 450 °C |
Coating 71 < Al | max | < 83 | [61] | |
| Arc | Alloyed cathodes | Coating 71 at 450 °C |
Coating 75 at 450 °C |
Coating 71 < Al | max | < 75 | [63] | |
| DC sputtering | Segmented target |
Coating 70 at 400 °C |
- | Coating 70 < Al | max | [64] | ||
| DC sputtering | Alloyed targets |
Targets | 1 | 70 at 500 °C |
- | Targets 70 < Al | max | [65] |
| Arc | Alloyed cathodes | Coating 70 at 500 °C |
Coating 82 at 500 °C |
Coating 70 < Al | max | < 82 | [66] |
The deposition process itself (source properties, parameters) has an influence at the maximum Al concentration on whether a pure fcc phase is obtained using X-ray diffraction, as will be shown for arc evaporation in
.
Taking measurement uncertainties into account, a well-accepted maximum critical value of the transition is about 70 at.% Al [61][62][63][64][65][66]. It should be mentioned that coatings with Al contents of 65–70 at.% might contain some traces of hcp phases, which may, however, be difficult to detect using XRD. For example, this effect was observed with SAED (Selected Area Electron Diffraction) measurement of (AlCr)N coatings deposited using arc evaporation from cathodes of Al
Cr
on sapphire [62]. The critical value of the transition from fcc to the mixed fcc plus hcp structure also depends slightly on the deposition conditions, influenced, for example, by the evaporator magnetic field set-up analogously to AlTiN [9], but bias and deposition pressure also have an influence on the “fine” structure in the area of the transition [45].
shows experimental results for the hardness and lattice parameters of arc-deposited (CrAl)N and (AlCr)N coatings [60][61]. Both studies show a hardness increase of about 60% compared to CrN for fcc-structured coatings in the range of Al 60–70 at.%. The differences in the absolute values are likely related to different deposition techniques and hardness measurement conditions. Furthermore, in the region of the mixed-phase structure of fcc + hcp at high Al-content, the hardness is equivalent to CrN. The lattice parameters decrease from 0.415–0.416 nm (CrN)) to 0.413 nm in the region of Al 60–70 at.%.

Hardness and lattice parameters of (CrAl)N and (AlCr)N coatings versus Al content deposited by cathodic vacuum arc, redrawn after [60][61], original © Elsevier.
Lattice parameters for (CrAl)N, (AlCr)N, CrN and AlN coatings calculated ab initio are shown in
and are compared with experimental XRD results [63]. The good fit of the calculated and the experimental data shows how well the basic properties of AlCr-based coatings can be calculated.

Lattice parameter calculated ab initio for CrN, (CrAl)N, (AlCr)N, and AlN coatings and experimentally measured XRD values, redrawn after [63], original © Elsevier.
The thermal expansion coefficients (TECs) of fcc-structured (Cr,Al)N and (Al,Cr)N coatings deposited by sputtering were investigated using synchrotron X-ray diffraction at up to 600 °C [65]. It was shown that the thermal expansion coefficient increases with an increasing Al content, from about 7 × 10
/K at room temperature to 10 × 10
/K at 600 °C, see
. Higher mean values of 14.5 × 10
/K were reported both for sputtered and arc-deposited (Al
Cr
)N coatings at room temperature [43]. A fair general estimate is thus (10.5 ± 3.5) × 10
/K.

Temperature-dependent thermal expansion coefficients (TECs) of (CrAl)N and (AlCr)N coatings derived from synchrotron experiments, redrawn after [65], original © Elsevier.
shows the thermal conductivity of (Ti
Al
)N, (Al
Ti
)N, and (Al
Cr
)N coatings [67]. The thermal conductivity is temperature-dependent and it is interesting to note that the thermal conductivity of (Al
Cr
)N drops at about 200 °C and, in the temperature range of 250–450 °C, is significantly lower than that of (Al
Ti
)N. The thermal properties of Cr
Al
Si
N
coatings were measured using pulsed photothermal radiometry. A very low thermal conductivity of ca. 2.75 W/mK at room temperature and 3.5 W/mK at 400 °C was found [68]. PVD coatings exhibit a certain anisotropy of thermal conductivity perpendicular and parallel to the direction of growth. This effect is particularly pronounced for multilayer coatings. When engineering the thermal properties of a coated part, not only the intrinsic thermal conductivity of the coatings, but also the concentration and dimension of different growth defects, e.g., holes and droplets, must be taken into account [69].

The temperature dependence of thermal conductivity for arc-deposited (Ti
Al
)N, (Al
Ti
)N and (Al
Cr
)N coatings, measured using the picosecond thermal reflection method, redrawn after [67], original © Elsevier.
A two-probe measurement method was used to estimate the surface resistance as a function of the Al/(Al + Cr) ratio for arc-deposited coatings. It can be seen in
that the electrical resistivity increases sharply with the Al portion of the metallic content in at.% [19].

Surface resistance as a function of the Al content of fcc-(Cr,Al)N and fcc-(Al,Cr)N arc-deposited coatings, redrawn after [19], original © Elsevier.
Ab initio calculations have shown that the Poisson’s ratio drops from about 0.27 for low Al contents to about 0.2 for an Al content of 70 at.% [70].
shows the ab initio calculated Young’s moduli (E) as a function of the Al content for fcc (Al,Cr)N [70][71]. Selected Young’s moduli measured by nanoindentation from [64][71] have been added.

Ab initio calculated Young’s moduli E and experimentally obtained indentation moduli (black symbols) for different Al concentrations in fcc-(Cr,Al)N and fcc-(Al,Cr)N coatings, redrawn after [70], original © AIP Publishing, data from [64][71].
The Young’s modulus increases with an increasing Al content. The same relative tendency, but with lower absolute values, was experimentally shown in [43]. The calculated values are in good agreement with measured nanoindentation moduli [64][72]. The Young’s modulus of (AlCr)N coatings drops significantly when the mixed-phase structure fcc + hcp is reached [43], as well as for Si-alloyed (AlCr)N coatings of, for example, Al
Cr
Si
N
O